Intel announces that they have plans to take back their lead in the CPU manufacturing industry earlier this year.
How they are to do this was not yet clear until they revealed their Intel Chips plans.
The company’s future plan was laid bare by Pat Gelsinger, the CEO at Intel, and the SVP of Technology Development at Intel, Dr. Ann Kelleher.
With the new developments at Intel, the old 10nm enhanced Superfin is now just 7.
This is one of the changes we are to see with this company – a renaming of the manufacturing nodes.
Beyond the 7nm, the company also has an aggressive schedule of releases and product updates that will be happening annually.
A good example is the expected Alder Lake chips that are to hit the market this fall. These will come with a mix of high and low cores.
Closely will follow a 4nm Meteor Lake chips that will ease into the “tile” design, referred to as the chiplet. This will incorporate Foveros, Intel’s 3D stacked-chip technology.
As if this is not enough, Intel will further its agenda by making a EUV-based 3nm node. This will use a high-energy manufacturing process that streamlines chip creation, coupled with a 20A for the angstrom node.
To put this into perspective, this is one ten-billionth of a meter.
An 18A node will follow closely after, with Intel hoping that this will be on course starting in 2025 and into the second half of the decade. These will be really tiny transistors.
These targets by Intel are quite aggressive, and going by past experience with this company’s track record on targets, they may not all be achieved in the set time.
But even if only a fraction of these targets is met, we can all expect our laptops to get huge boosts in performance in the next few years.